{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9595651","patent":{"patent_number":"US-9595651","title":"Electronic component package and method for manufacturing same","assignee":null,"inventors":[],"filing_date":"2013-12-20T00:00:00.000Z","publication_date":"2017-03-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"A method for manufacturing an electronic component package comprises: (i) preparing a metal foil having opposed principal surface “A” for placement of an electronic component and principal surface “B”, and a through-hole located in an electronic component-placement region of surface “A”; (ii) placing the electronic component on the metal foil such that the electronic component is positioned in the electronic component-placement region, and an opening of the through-hole is capped with an electrode of the electronic component; (iii) forming a sealing resin layer on surface “A” such that the electronic component is covered with the sealing resin layer; and (iv) forming a metal plating layer on surface “B”. A dry plating process and a wet plating process are performed to form the metal plating layer in step (iv) such that the through-hole is filled with the metal plating layer, and the metal foil and the metal plating layer are integrated."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic component package and method for manufacturing same","description":"A method for manufacturing an electronic component package comprises: (i) preparing a metal foil having opposed principal surface “A” for placement of an electronic component and principal surface “B”","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9595651","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9595651","citation_suggestion":"Patentable. \"Electronic component package and method for manufacturing same\" (US-9595651). https://patentable.app/patents/US-9595651","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9595651","json":"https://patentable.app/api/llm-context/US-9595651","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:12:45.041Z"}