{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9596747","patent":{"patent_number":"US-9596747","title":"Wiring substrate and electronic device","assignee":null,"inventors":[],"filing_date":"2012-06-29T00:00:00.000Z","publication_date":"2017-03-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":3,"abstract":"A wiring substrate in which a plating layer is sufficiently plated on a surface metal layer and which has an excellent reliability is provided. A wiring substrate includes an insulating base; a heat dissipation member disposed in the insulating base, the heat dissipation member partially exposed from the insulating base, the heat dissipation member containing Cu; a surface metal layer disposed on a surface of the insulating base, the surface metal layer contacting and covering the heat dissipation member, the surface metal layer containing Mo as a main component, the surface metal layer including a surface portion containing Cu; and a plating layer disposed on the surface metal layer, wherein Cu contained in the heat dissipation member and Cu contained in the surface portion are bonded to each other."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring substrate and electronic device","description":"A wiring substrate in which a plating layer is sufficiently plated on a surface metal layer and which has an excellent reliability is provided. A wiring substrate includes an insulating base; a heat d","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9596747","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9596747","citation_suggestion":"Patentable. \"Wiring substrate and electronic device\" (US-9596747). https://patentable.app/patents/US-9596747","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9596747","json":"https://patentable.app/api/llm-context/US-9596747","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:20:57.798Z"}