{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9596765","patent":{"patent_number":"US-9596765","title":"Manufacturing method for component incorporated substrate and component incorporated substrate manufactured using the method","assignee":null,"inventors":[],"filing_date":"2012-09-11T00:00:00.000Z","publication_date":"2017-03-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component with reference to a mark formed on a copper layer, the mark consisting of a material less easily etched than copper by a copper etching agent used for etching of copper, after mounting the electronic component on the copper layer with an adhesive layer interposed therebetween, embedding the electronic component and the mark in an insulating substrate, thereafter, etching and removing a part of the copper layer to form a window for exposing the mark, forming an LVH reaching a terminal of the electronic component with reference to the exposed mark, electrically connecting the terminal and the copper layer via a conduction via formed by applying copper plating to the LVH, and, thereafter, forming the copper layer into a wiring pattern."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Manufacturing method for component incorporated substrate and component incorporated substrate manufactured using the method","description":"A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component with reference to a mark formed on a copper layer, the mar","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9596765","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9596765","citation_suggestion":"Patentable. \"Manufacturing method for component incorporated substrate and component incorporated substrate manufactured using the method\" (US-9596765). https://patentable.app/patents/US-9596765","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9596765","json":"https://patentable.app/api/llm-context/US-9596765","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:37:27.725Z"}