{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9600424","patent":{"patent_number":"US-9600424","title":"Semiconductor chips, semiconductor chip packages including the same, and semiconductor systems including the same","assignee":null,"inventors":[],"filing_date":"2014-02-07T00:00:00.000Z","publication_date":"2017-03-21T00:00:00.000Z","cpc_codes":["G06F","H01L","H01L"],"num_claims":25,"abstract":"Semiconductor chips are provided. The semiconductor chip includes a first data pad, a first data strobe pad and a second data pad sequentially arrayed from a command address pad in a first direction. In addition, the semiconductor chip includes a third data pad, a second data strobe pad and a fourth data pad sequentially arrayed from the command address pad in a second direction. Data are inputted and outputted through the first and fourth data pads or through the second and third data pads in a predetermined bit organization. Related semiconductor chip packages and semiconductor systems are also provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor chips, semiconductor chip packages including the same, and semiconductor systems including the same","description":"Semiconductor chips are provided. The semiconductor chip includes a first data pad, a first data strobe pad and a second data pad sequentially arrayed from a command address pad in a first direction. ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9600424","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9600424","citation_suggestion":"Patentable. \"Semiconductor chips, semiconductor chip packages including the same, and semiconductor systems including the same\" (US-9600424). https://patentable.app/patents/US-9600424","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9600424","json":"https://patentable.app/api/llm-context/US-9600424","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T13:39:28.313Z"}