{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9601374","patent":{"patent_number":"US-9601374","title":"Semiconductor die assembly","assignee":null,"inventors":[],"filing_date":"2015-03-26T00:00:00.000Z","publication_date":"2017-03-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":27,"abstract":"A semiconductor die assembly having a solderball wirebonded to a substrate. As an example, the semiconductor die assembly may include the solderball attached to a bond pad on a face surface of a memory die. A non-face surface of the memory die can be attached to the substrate. A wire can be wirebonded to the solderball at a first end of the wire and connected to the substrate at a second end of the wire."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor die assembly","description":"A semiconductor die assembly having a solderball wirebonded to a substrate. As an example, the semiconductor die assembly may include the solderball attached to a bond pad on a face surface of a memor","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9601374","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9601374","citation_suggestion":"Patentable. \"Semiconductor die assembly\" (US-9601374). https://patentable.app/patents/US-9601374","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9601374","json":"https://patentable.app/api/llm-context/US-9601374","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:57:16.591Z"}