{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9601402","patent":{"patent_number":"US-9601402","title":"Package apparatus and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2014-10-03T00:00:00.000Z","publication_date":"2017-03-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":34,"abstract":"A package apparatus comprises a first wiring layer, a metal layer, a conductive pillar layer, a passive component, a first molding compound layer, a second wiring layer, and a protection layer. The first wiring layer has a first surface and a second surface opposite to each other. The metal layer is disposed on the first surface of the first wiring layer. The conductive pillar layer is disposed on the second surface of the first wiring layer. The passive component is disposed on the second surface of the first wiring layer. The first molding compound layer is disposed within a part of the zone of the first wiring layer and the conductive pillar layer. The second wiring layer is disposed on the first molding compound layer and one end of the conductive pillar layer. The protection layer is disposed on the first molding compound layer and the second wiring layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package apparatus and manufacturing method thereof","description":"A package apparatus comprises a first wiring layer, a metal layer, a conductive pillar layer, a passive component, a first molding compound layer, a second wiring layer, and a protection layer. The fi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9601402","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9601402","citation_suggestion":"Patentable. \"Package apparatus and manufacturing method thereof\" (US-9601402). https://patentable.app/patents/US-9601402","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9601402","json":"https://patentable.app/api/llm-context/US-9601402","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T17:45:59.973Z"}