{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9601405","patent":{"patent_number":"US-9601405","title":"Semiconductor package with an enhanced thermal pad","assignee":null,"inventors":[],"filing_date":"2015-07-22T00:00:00.000Z","publication_date":"2017-03-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":59,"abstract":"A semiconductor package having a substrate, a thermal pad, and a semiconductor die is disclosed. The thermal pad may have a heat conductive body extending through the substrate. The semiconductor die may be disposed on the thermal pad and in thermal communication with the thermal pad. The thermal pad of the semiconductor package may also have an interlock structure. The interlock structure may provide a mechanical interlock between the thermal pad and the substrate. In addition, a wireless communication device is also disclosed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package with an enhanced thermal pad","description":"A semiconductor package having a substrate, a thermal pad, and a semiconductor die is disclosed. The thermal pad may have a heat conductive body extending through the substrate. The semiconductor die ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9601405","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9601405","citation_suggestion":"Patentable. \"Semiconductor package with an enhanced thermal pad\" (US-9601405). https://patentable.app/patents/US-9601405","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9601405","json":"https://patentable.app/api/llm-context/US-9601405","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:58:51.575Z"}