{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9601409","patent":{"patent_number":"US-9601409","title":"Protruding contact for integrated chip","assignee":null,"inventors":[],"filing_date":"2014-12-29T00:00:00.000Z","publication_date":"2017-03-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"The present disclosure relates to a method of forming a back-end-of-the-line metal contact that eliminates RC opens caused by metal dishing during chemical mechanical polishing. The method is performed by depositing a sacrificial UV/thermal decomposition layer (UTDL) above an inter-level dielectric (ILD) layer. A metal contact is formed that extend through the ILD layer and the sacrificial UTDL. A chemical mechanical polishing (CMP) process is performed to generate a planar surface comprising the sacrificial UTDL. The sacrificial UTDL is then removed through an ultraviolet exposure or a thermal anneal, so that the metal contact protrudes from the ILD layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Protruding contact for integrated chip","description":"The present disclosure relates to a method of forming a back-end-of-the-line metal contact that eliminates RC opens caused by metal dishing during chemical mechanical polishing. The method is performe","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9601409","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9601409","citation_suggestion":"Patentable. \"Protruding contact for integrated chip\" (US-9601409). https://patentable.app/patents/US-9601409","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9601409","json":"https://patentable.app/api/llm-context/US-9601409","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T14:37:45.376Z"}