{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9601413","patent":{"patent_number":"US-9601413","title":"Cavity package with die attach pad","assignee":null,"inventors":[],"filing_date":"2014-04-11T00:00:00.000Z","publication_date":"2017-03-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"A cavity package is provided. The package can include a metal leadframe and a substrate attached to an interposer formed as part of the leadframe. The substrate typically has a coefficient of thermal expansion matched to the coefficient of thermal expansion of a semiconductor device to be affixed to the substrate. The semiconductor device is typically attached to an exposed top surface of the substrate. The cavity package also includes a plastic portion molded to the leadframe forming a substrate cavity. The substrate cavity allows access to the exposed top surface of the substrate for affixing the semiconductor device. The cavity package also include a connective element for grounding a lid through an electrical path from the lid to the interposer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Cavity package with die attach pad","description":"A cavity package is provided. The package can include a metal leadframe and a substrate attached to an interposer formed as part of the leadframe. The substrate typically has a coefficient of thermal ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9601413","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9601413","citation_suggestion":"Patentable. \"Cavity package with die attach pad\" (US-9601413). https://patentable.app/patents/US-9601413","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9601413","json":"https://patentable.app/api/llm-context/US-9601413","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:19:19.023Z"}