{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9601419","patent":{"patent_number":"US-9601419","title":"Stacked leadframe packages","assignee":null,"inventors":[],"filing_date":"2014-06-06T00:00:00.000Z","publication_date":"2017-03-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"A multi-package unit having stacked packages is provided. A multi-package unit may include a first package and a second package mounted on the first package. The first package may be a leadframe package that includes metal leads extending beyond the perimeter of the first package. The first package may include a first integrated circuit die assembled within the first package using the wirebond configuration or the flip-chip configuration. The second package may be a leadframe package or a leadless package that includes a second integrated circuit die. The second package may be smaller than the first package. The first and second integrated circuit dies may be formed using different integrated circuit fabrication technologies."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stacked leadframe packages","description":"A multi-package unit having stacked packages is provided. A multi-package unit may include a first package and a second package mounted on the first package. The first package may be a leadframe packa","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9601419","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9601419","citation_suggestion":"Patentable. \"Stacked leadframe packages\" (US-9601419). https://patentable.app/patents/US-9601419","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9601419","json":"https://patentable.app/api/llm-context/US-9601419","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:19:27.108Z"}