{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9601422","patent":{"patent_number":"US-9601422","title":"Printed wiring board, semiconductor package, and method for manufacturing printed wiring board","assignee":null,"inventors":[],"filing_date":"2015-05-26T00:00:00.000Z","publication_date":"2017-03-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A printed wiring board includes a first interlayer, a first conductive layer on first-surface side of the first interlayer, a second conductive layer on second-surface side of the first interlayer, a first buildup layer including interlayers and conductive layers and formed on first surface of the first interlayer, and a second buildup layer including interlayers and conductive layers and formed on second surface of the first interlayer. The first conductive layer is formed such that the first conductive layer is embedded in the first interlayer and exposing surface on the first surface of the first interlayer, the second conductive layer is formed on the second surface of the first interlayer, and the interlayers in the first buildup layer include a second interlayer positioned adjacent to the first conductive layer and having the greatest thickness among the first interlayer and interlayers in the first and second buildup layers."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Printed wiring board, semiconductor package, and method for manufacturing printed wiring board","description":"A printed wiring board includes a first interlayer, a first conductive layer on first-surface side of the first interlayer, a second conductive layer on second-surface side of the first interlayer, a ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9601422","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9601422","citation_suggestion":"Patentable. \"Printed wiring board, semiconductor package, and method for manufacturing printed wiring board\" (US-9601422). https://patentable.app/patents/US-9601422","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9601422","json":"https://patentable.app/api/llm-context/US-9601422","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:50:31.133Z"}