{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9601447","patent":{"patent_number":"US-9601447","title":"Semiconductor device including plural semiconductor chips stacked on substrate","assignee":null,"inventors":[],"filing_date":"2015-05-15T00:00:00.000Z","publication_date":"2017-03-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":21,"abstract":"A semiconductor chip at least includes a row of first electrode pad group, which includes at least one first independent electrode pad and multiple first common electrode pads. The interval between the first independent electrode pad and an electrode pad adjacent thereto is defined as “first pitch”, and the interval between adjacent electrode pads making up the multiple first common electrode pads is defined as “second pitch”. The first pitch is determined to be larger than the second pitch."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device including plural semiconductor chips stacked on substrate","description":"A semiconductor chip at least includes a row of first electrode pad group, which includes at least one first independent electrode pad and multiple first common electrode pads. The interval between th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9601447","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9601447","citation_suggestion":"Patentable. \"Semiconductor device including plural semiconductor chips stacked on substrate\" (US-9601447). https://patentable.app/patents/US-9601447","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9601447","json":"https://patentable.app/api/llm-context/US-9601447","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:03:09.672Z"}