{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9601456","patent":{"patent_number":"US-9601456","title":"System-in-package module and manufacture method for a system-in-package module","assignee":null,"inventors":[],"filing_date":"2015-01-19T00:00:00.000Z","publication_date":"2017-03-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A system-in-package module includes a non-memory chip, a bundled memory, and an encapsulation package material. The non-memory chip has a plurality of pads. The bundled memory includes a first memory die and a second memory die side-by-side formed over a substrate, wherein the first memory die includes a first group of pads and the second memory die includes a second group of pads. The encapsulation package material encloses the non-memory chip and the bundled memory, and the non-memory chip is electronically coupling with the bundled memory through the plurality of pads, the first and the second group of pads. The first group of pads corresponds to the second group of pads by rotating a predetermined degree or by mirror mapping."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"System-in-package module and manufacture method for a system-in-package module","description":"A system-in-package module includes a non-memory chip, a bundled memory, and an encapsulation package material. The non-memory chip has a plurality of pads. The bundled memory includes a first memory ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9601456","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9601456","citation_suggestion":"Patentable. \"System-in-package module and manufacture method for a system-in-package module\" (US-9601456). https://patentable.app/patents/US-9601456","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9601456","json":"https://patentable.app/api/llm-context/US-9601456","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T14:51:24.409Z"}