{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9601470","patent":{"patent_number":"US-9601470","title":"Stacked semiconductor device, printed circuit board, and method for manufacturing stacked semiconductor device","assignee":null,"inventors":[],"filing_date":"2014-06-19T00:00:00.000Z","publication_date":"2017-03-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A stacked semiconductor device includes a first semiconductor package and a second semiconductor package stacked thereon, and further includes a plate member interposed between the first semiconductor package and the second semiconductor package. The plate member has a plate body, protruding strips protruding toward its edges from the plate body, and leg portions respectively provided on the protruding strips. Each of the leg portions is disposed on a surface, which opposes one surface of a wiring substrate, of the protruding strip, and contacts the one surface of the wiring substrate. Thus, defective connection of connecting terminals due to warping of the wiring substrate and loading inclination of the first semiconductor package is reduced, resulting in an improved yield."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stacked semiconductor device, printed circuit board, and method for manufacturing stacked semiconductor device","description":"A stacked semiconductor device includes a first semiconductor package and a second semiconductor package stacked thereon, and further includes a plate member interposed between the first semiconductor","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9601470","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9601470","citation_suggestion":"Patentable. \"Stacked semiconductor device, printed circuit board, and method for manufacturing stacked semiconductor device\" (US-9601470). https://patentable.app/patents/US-9601470","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9601470","json":"https://patentable.app/api/llm-context/US-9601470","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:36:59.102Z"}