{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9603247","patent":{"patent_number":"US-9603247","title":"Electronic package with narrow-factor via including finish layer","assignee":null,"inventors":[],"filing_date":"2014-08-11T00:00:00.000Z","publication_date":"2017-03-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"This disclosure relates generally to an electronic package and methods that include an electrically conductive pad, a package insulator layer including a substantially non-conductive material, the package insulator layer being substantially planar, and a via. The via may be formed within the package insulator layer and electrically coupled to the electrically conductive pad. The via may include a conductor extending vertically through at least part of the package insulator layer and having a first end proximate the electrically conductive pad and a second end opposite the first end and a finish layer secured to the second end of the conductor, the finish layer including a gold compound."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic package with narrow-factor via including finish layer","description":"This disclosure relates generally to an electronic package and methods that include an electrically conductive pad, a package insulator layer including a substantially non-conductive material, the pac","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9603247","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9603247","citation_suggestion":"Patentable. \"Electronic package with narrow-factor via including finish layer\" (US-9603247). https://patentable.app/patents/US-9603247","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9603247","json":"https://patentable.app/api/llm-context/US-9603247","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:36:58.048Z"}