{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9603249","patent":{"patent_number":"US-9603249","title":"Direct metalization of electrical circuit structures","assignee":null,"inventors":[],"filing_date":"2012-09-06T00:00:00.000Z","publication_date":"2017-03-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the first surface of the first circuitry layer to include a plurality of first recesses. A conductive material is plated on surfaces of a plurality of the first recesses to form a plurality of first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. A filler material is deposited in the first conductive structures. At least a second dielectric layer is printed on the first dielectric layer to include a plurality of second recesses generally aligned with a plurality of the first conductive structures. A conductive material is plated on surfaces of a plurality of the second recesses to form a plurality of second conductive structures electrically coupled to, and extending parallel to the first conductive structures."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Direct metalization of electrical circuit structures","description":"An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the first surface of the first circuitry layer t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9603249","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9603249","citation_suggestion":"Patentable. \"Direct metalization of electrical circuit structures\" (US-9603249). https://patentable.app/patents/US-9603249","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9603249","json":"https://patentable.app/api/llm-context/US-9603249","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:15:58.489Z"}