{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9603253","patent":{"patent_number":"US-9603253","title":"Wiring substrate, manufacturing method therefor, and semiconductor package","assignee":null,"inventors":[],"filing_date":"2015-01-07T00:00:00.000Z","publication_date":"2017-03-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A wiring substrate includes a heat radiation plate and a substrate provided on the heat radiation plate interposed by an adhesive layer. The substrate includes a first surface on which the adhesive layer is provided and a second surface on an opposite side of the first surface. The wiring substrate also includes a wiring provided on the second surface of the substrate, and a notch part that penetrates the substrate in a thickness direction of the substrate, with the notch part being formed by notching the wiring substrate inward from an outer edge part of the substrate from a plan view. The adhesive layer covers an end surface of the substrate that is exposed in an inner wall surface of the notch part."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring substrate, manufacturing method therefor, and semiconductor package","description":"A wiring substrate includes a heat radiation plate and a substrate provided on the heat radiation plate interposed by an adhesive layer. The substrate includes a first surface on which the adhesive la","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9603253","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9603253","citation_suggestion":"Patentable. \"Wiring substrate, manufacturing method therefor, and semiconductor package\" (US-9603253). https://patentable.app/patents/US-9603253","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9603253","json":"https://patentable.app/api/llm-context/US-9603253","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T16:53:18.442Z"}