{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9603262","patent":{"patent_number":"US-9603262","title":"Electronic component mounting apparatus and method","assignee":null,"inventors":[],"filing_date":"2015-09-30T00:00:00.000Z","publication_date":"2017-03-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":2,"abstract":"An electronic component mounting apparatus includes a bonding tool for thermally bonding an electronic component onto a substrate, the bonding tool to be driven in a direction getting close to and from the substrate, a linear scale and a linear scale head detecting the position of the bonding tool in the direction getting close to and from the substrate, and a control unit configured to hold the position of the bonding tool in the direction getting close to and from the substrate when a solder film between an electrode of the electronic component and an electrode of the substrate is thermally fused when the bonding tool gets close to the substrate by a predetermined distance from a reference position while heating the electronic component. The electronic component mounting apparatus for bonding the electronic component and the substrate with thermally fusible bond metal offers an improvement in the bonding quality."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic component mounting apparatus and method","description":"An electronic component mounting apparatus includes a bonding tool for thermally bonding an electronic component onto a substrate, the bonding tool to be driven in a direction getting close to and fro","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9603262","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9603262","citation_suggestion":"Patentable. \"Electronic component mounting apparatus and method\" (US-9603262). https://patentable.app/patents/US-9603262","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9603262","json":"https://patentable.app/api/llm-context/US-9603262","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:52:26.114Z"}