{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9603265","patent":{"patent_number":"US-9603265","title":"Multi-layered printed circuit board having inner-layer portion and outer-layer portions and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2015-05-06T00:00:00.000Z","publication_date":"2017-03-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"A multi-layered printed circuit board and a manufacturing method thereof are disclosed. The multi-layered printed circuit board in accordance with an aspect of the present invention includes: an inner-layer portion having an inner-layer wired pattern formed thereon; outer-layer portions having inner-layer wired portions formed thereon and being laminated on either surface of the inner-layer portion; a first via-hole formed to penetrate one of the outer-layer portions so as to be connected to a first point of the inner-layer wired pattern; and a second via-hole formed to penetrate the other of the outer-layer portions so as to be connected with a second point of the inner-layer wired pattern. The second via-hole is formed in an area of the inner-layer portion and the outer-layer portions that is removed through external form processing."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multi-layered printed circuit board having inner-layer portion and outer-layer portions and manufacturing method thereof","description":"A multi-layered printed circuit board and a manufacturing method thereof are disclosed. The multi-layered printed circuit board in accordance with an aspect of the present invention includes: an inner","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9603265","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9603265","citation_suggestion":"Patentable. \"Multi-layered printed circuit board having inner-layer portion and outer-layer portions and manufacturing method thereof\" (US-9603265). https://patentable.app/patents/US-9603265","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9603265","json":"https://patentable.app/api/llm-context/US-9603265","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:07:49.176Z"}