{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9607860","patent":{"patent_number":"US-9607860","title":"Electronic package structure and fabrication method thereof","assignee":null,"inventors":[],"filing_date":"2015-12-28T00:00:00.000Z","publication_date":"2017-03-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A method for fabricating an electronic package structure is provided, which includes the steps of: forming a circuit layer on a conductor; disposing an electronic element on the circuit layer; forming an insulating layer on the conductor to encapsulate the electronic element and the circuit layer; and removing portions of the conductor so as to cause the remaining portions of the conductor to constitute a plurality of conductive bumps. As such, when the electronic package structure is disposed on a circuit board through an SMT (Surface Mount Technology) process, the conductive bumps are easily aligned with contacts of the circuit board, thereby effectively improving the yield of the SMT process."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic package structure and fabrication method thereof","description":"A method for fabricating an electronic package structure is provided, which includes the steps of: forming a circuit layer on a conductor; disposing an electronic element on the circuit layer; forming","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9607860","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9607860","citation_suggestion":"Patentable. \"Electronic package structure and fabrication method thereof\" (US-9607860). https://patentable.app/patents/US-9607860","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9607860","json":"https://patentable.app/api/llm-context/US-9607860","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:50:56.566Z"}