{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9607896","patent":{"patent_number":"US-9607896","title":"Use of repellent material to protect fabrication regions in semi conductor assembly","assignee":null,"inventors":[],"filing_date":"2014-01-02T00:00:00.000Z","publication_date":"2017-03-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"A method of preparing semiconductor dies from a semiconductor wafer having a plurality of fabrication regions separated by dicing lines on the top side of the wafer, and an adhesive coating on the back side of the wafer, comprises applying a repellent material to the fabrication regions and dicing lines where the adhesive coating is not intended to be printed; applying the adhesive coating to the back side of the wafer; removing the repellent material; and separating the wafer along the dicing lines into individual dies."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Use of repellent material to protect fabrication regions in semi conductor assembly","description":"A method of preparing semiconductor dies from a semiconductor wafer having a plurality of fabrication regions separated by dicing lines on the top side of the wafer, and an adhesive coating on the bac","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9607896","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9607896","citation_suggestion":"Patentable. \"Use of repellent material to protect fabrication regions in semi conductor assembly\" (US-9607896). https://patentable.app/patents/US-9607896","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9607896","json":"https://patentable.app/api/llm-context/US-9607896","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:29:59.488Z"}