{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9607936","patent":{"patent_number":"US-9607936","title":"Copper bump joint structures with improved crack resistance","assignee":null,"inventors":[],"filing_date":"2009-11-16T00:00:00.000Z","publication_date":"2017-03-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"An integrated circuit structure includes a first work piece and a second work piece. The first work piece includes a semiconductor substrate, and a copper bump over the semiconductor substrate. The second work piece includes a bond pad. A solder is between and adjoining the first work piece and the second work piece, wherein the solder electrically connects the copper bump to the bond pad. The solder includes palladium."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Copper bump joint structures with improved crack resistance","description":"An integrated circuit structure includes a first work piece and a second work piece. The first work piece includes a semiconductor substrate, and a copper bump over the semiconductor substrate. The se","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9607936","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9607936","citation_suggestion":"Patentable. \"Copper bump joint structures with improved crack resistance\" (US-9607936). https://patentable.app/patents/US-9607936","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9607936","json":"https://patentable.app/api/llm-context/US-9607936","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:55:07.459Z"}