{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9607948","patent":{"patent_number":"US-9607948","title":"Method and circuits for communication in multi-die packages","assignee":null,"inventors":[],"filing_date":"2015-03-31T00:00:00.000Z","publication_date":"2017-03-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"Various example implementations are directed to circuits and methods for inter-die communication on a multi-die integrated circuit (IC) package. According to an example implementation, an IC package includes a first semiconductor die having a plurality of communication circuits for communicating data over respective data terminals of the package. The package also includes a second semiconductor die having N contacts for communicating data to and from the semiconductor die. The second semiconductor die includes a logic circuit configured to communicate M parallel data signals with one or more other semiconductor dies of the package, wherein M>N. The second semiconductor die also includes a plurality of serializer circuits, each configured to serialize data from a respective subset of the plurality of the M signal lines to produce serialized data and provide the serialized data to a respective one of the contacts."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method and circuits for communication in multi-die packages","description":"Various example implementations are directed to circuits and methods for inter-die communication on a multi-die integrated circuit (IC) package. According to an example implementation, an IC package i","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9607948","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9607948","citation_suggestion":"Patentable. \"Method and circuits for communication in multi-die packages\" (US-9607948). https://patentable.app/patents/US-9607948","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9607948","json":"https://patentable.app/api/llm-context/US-9607948","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:56:06.948Z"}