{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9607959","patent":{"patent_number":"US-9607959","title":"Packaging device having plural microstructures disposed proximate to die mounting region","assignee":null,"inventors":[],"filing_date":"2014-08-27T00:00:00.000Z","publication_date":"2017-03-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An example packaging device includes a substrate having an integrated circuit die mounting region disposed thereon. A plurality of microstructures are disposed proximate a side of the integrated circuit die mounting region. The plurality of microstructures each include an outer insulating layer over a conductive material. An example packaged semiconductor device includes a substrate having an integrated circuit die mounting region disposed thereon. A plurality of columnar microstructures are disposed on the substrate perpendicular to a major surface of the substrate and proximate a side of the integrated circuit die mounting region. An underfill material is disposed between the substrate and the integrated circuit die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Packaging device having plural microstructures disposed proximate to die mounting region","description":"An example packaging device includes a substrate having an integrated circuit die mounting region disposed thereon. A plurality of microstructures are disposed proximate a side of the integrated circu","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9607959","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9607959","citation_suggestion":"Patentable. \"Packaging device having plural microstructures disposed proximate to die mounting region\" (US-9607959). https://patentable.app/patents/US-9607959","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9607959","json":"https://patentable.app/api/llm-context/US-9607959","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:15:12.711Z"}