{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9607960","patent":{"patent_number":"US-9607960","title":"Bonding structure and flexible device","assignee":null,"inventors":[],"filing_date":"2015-12-29T00:00:00.000Z","publication_date":"2017-03-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A bonding structure comprising a contact pad, an anisotropic conductive film (ACF) and a contact structure is provided. The contact pad includes at least one recess, wherein a thickness of the contact pad is T, and a width of the at least one recess is B, The ACF is disposed on the contact pad and includes a plurality of conductive particles; each of the conductive particles is disposed in the at least one recess. A diameter of the conductive particles is A, and A is larger than B and T and satisfies B≦2(AT−T2)1/2. The contact structure is disposed on the ACF and electrically connected to the contact pad via the conductive particles. The disclosure also provides a flexible device including a substrate, a patterned insulating layer, at least one contact pad, ACF, and a contact structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Bonding structure and flexible device","description":"A bonding structure comprising a contact pad, an anisotropic conductive film (ACF) and a contact structure is provided. The contact pad includes at least one recess, wherein a thickness of the contact","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9607960","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9607960","citation_suggestion":"Patentable. \"Bonding structure and flexible device\" (US-9607960). https://patentable.app/patents/US-9607960","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9607960","json":"https://patentable.app/api/llm-context/US-9607960","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:04:30.996Z"}