{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9607969","patent":{"patent_number":"US-9607969","title":"Package including a plurality of stacked semiconductor devices including a capacitance enhanced through via and method of manufacture","assignee":null,"inventors":[],"filing_date":"2016-11-21T00:00:00.000Z","publication_date":"2017-03-28T00:00:00.000Z","cpc_codes":["H01L","G11C","G11C","G11C","G11C","G11C","G11C","G11C","G11C","G11C","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package can include a plurality of semiconductor devices stacked in a first direction and commonly sharing at least a first reference potential and a data signal; each semiconductor device including a first through via electrically connected to receive the first reference potential and a second through via electrically connected to receive the data signal, each first through via provides an electrical connection in the first direction between a first side and a second side opposite the first side of one of the plurality of semiconductor devices. A total first through via capacitance value is substantially greater than the total second through via capacitance value."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package including a plurality of stacked semiconductor devices including a capacitance enhanced through via and method of manufacture","description":"A package can include a plurality of semiconductor devices stacked in a first direction and commonly sharing at least a first reference potential and a data signal; each semiconductor device including","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9607969","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9607969","citation_suggestion":"Patentable. \"Package including a plurality of stacked semiconductor devices including a capacitance enhanced through via and method of manufacture\" (US-9607969). https://patentable.app/patents/US-9607969","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9607969","json":"https://patentable.app/api/llm-context/US-9607969","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:36:02.190Z"}