{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9608004","patent":{"patent_number":"US-9608004","title":"Semiconductor device and peeling off method and method of manufacturing semiconductor device","assignee":null,"inventors":[],"filing_date":"2015-11-27T00:00:00.000Z","publication_date":"2017-03-28T00:00:00.000Z","cpc_codes":["G02F","H01L","H01L","G02F","G02F","G02F","H01L"],"num_claims":21,"abstract":"The present invention provides a peeling off method without giving damage to the peeled off layer, and aims at being capable of peeling off not only a peeled off layer having a small area but also a peeled off layer having a large area over the entire surface at excellent yield ratio. The metal layer or nitride layer 11 is provided on the substrate, and further, the oxide layer 12 being contact with the foregoing metal layer or nitride layer 11 is provided, and furthermore, if the lamination film formation or the heat processing of 500° C. or more in temperature is carried out, it can be easily and clearly separated in the layer or on the interface with the oxide layer 12 by the physical means."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and peeling off method and method of manufacturing semiconductor device","description":"The present invention provides a peeling off method without giving damage to the peeled off layer, and aims at being capable of peeling off not only a peeled off layer having a small area but also a p","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9608004","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9608004","citation_suggestion":"Patentable. \"Semiconductor device and peeling off method and method of manufacturing semiconductor device\" (US-9608004). https://patentable.app/patents/US-9608004","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9608004","json":"https://patentable.app/api/llm-context/US-9608004","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:40:43.759Z"}