{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9609748","patent":{"patent_number":"US-9609748","title":"Semiconductor module comprising printed circuit board and method for producing a semiconductor module comprising a printed circuit board","assignee":null,"inventors":[],"filing_date":"2014-09-29T00:00:00.000Z","publication_date":"2017-03-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":21,"abstract":"A semiconductor module includes a printed circuit board, a ceramic substrate and a semiconductor chip. The printed circuit board includes an insulating material, a cutout formed in the insulating material, and a first metallization layer, which is partly embedded into the insulating material. The first metallization layer includes a conductor track projection projecting into the cutout. The ceramic substrate includes a dielectric, ceramic insulation carrier, and an upper substrate metallization applied to a top side of the insulation carrier. The semiconductor chip is arranged on the upper substrate metallization, and the first metallization layer is mechanically and electrically conductively connected to the upper substrate metallization at the conductor track projection."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor module comprising printed circuit board and method for producing a semiconductor module comprising a printed circuit board","description":"A semiconductor module includes a printed circuit board, a ceramic substrate and a semiconductor chip. The printed circuit board includes an insulating material, a cutout formed in the insulating mate","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9609748","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9609748","citation_suggestion":"Patentable. \"Semiconductor module comprising printed circuit board and method for producing a semiconductor module comprising a printed circuit board\" (US-9609748). https://patentable.app/patents/US-9609748","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9609748","json":"https://patentable.app/api/llm-context/US-9609748","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:35:37.726Z"}