{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9609751","patent":{"patent_number":"US-9609751","title":"Package substrate comprising surface interconnect and cavity comprising electroless fill","assignee":null,"inventors":[],"filing_date":"2014-04-11T00:00:00.000Z","publication_date":"2017-03-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"Some novel features pertain to a substrate that includes a first dielectric layer, a first interconnect, a first cavity, and a first electroless metal layer. The first dielectric layer includes a first surface and a second surface. The first interconnect is on the first surface of the substrate layer. The first cavity traverses the first surface of the first dielectric layer. The first electroless metal layer is formed at least partially in the first cavity. The first electroless metal layer defines a second interconnect embedded in the first dielectric layer. In some implementations, the substrate further includes a core layer. The core layer includes a first surface and a second surface. The first surface of the core layer is coupled to the second surface of the first dielectric layer. In some implementations, the substrate further includes a second dielectric layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package substrate comprising surface interconnect and cavity comprising electroless fill","description":"Some novel features pertain to a substrate that includes a first dielectric layer, a first interconnect, a first cavity, and a first electroless metal layer. The first dielectric layer includes a firs","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9609751","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9609751","citation_suggestion":"Patentable. \"Package substrate comprising surface interconnect and cavity comprising electroless fill\" (US-9609751). https://patentable.app/patents/US-9609751","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9609751","json":"https://patentable.app/api/llm-context/US-9609751","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:14:59.221Z"}