{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9611138","patent":{"patent_number":"US-9611138","title":"Through-wafer interconnects for MEMS double-sided fabrication process (TWIDS)","assignee":null,"inventors":[],"filing_date":"2015-10-12T00:00:00.000Z","publication_date":"2017-04-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":19,"abstract":"A high-aspect ratio low resistance through-wafer interconnect for double-sided (TWIDS) fabrication of microelectromechanical systems (MEMS) serves as an interconnection method and structure for co-integration of MEMS and integrated circuits or other microcomponent utilizing both sides of the wafer. TWIDS applied to a three dimensional folded TIMU (timing inertial measurement unit) provides a path for electrical signals from sensors on the front side of the SOI wafer to electronic components on the back side of the wafer, while enabling folding of an array of sensors in a three dimensional shape."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Through-wafer interconnects for MEMS double-sided fabrication process (TWIDS)","description":"A high-aspect ratio low resistance through-wafer interconnect for double-sided (TWIDS) fabrication of microelectromechanical systems (MEMS) serves as an interconnection method and structure for co-int","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9611138","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9611138","citation_suggestion":"Patentable. \"Through-wafer interconnects for MEMS double-sided fabrication process (TWIDS)\" (US-9611138). https://patentable.app/patents/US-9611138","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9611138","json":"https://patentable.app/api/llm-context/US-9611138","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:39:35.337Z"}