{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9613832","patent":{"patent_number":"US-9613832","title":"Mold release film and process for producing semiconductor package","assignee":null,"inventors":[],"filing_date":"2016-03-04T00:00:00.000Z","publication_date":"2017-04-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"A mold release film to be disposed on a cavity surface of a mold in a method for producing a semiconductor package wherein a semiconductor element is disposed in the mold and encapsulated with a curable resin to form a resin-encapsulation portion, characterized in that it has a first surface to be in contact with the curable resin at the time of forming the resin-encapsulation portion, and a second surface to be in contact with the cavity surface, at least one of the first surface and the second surface has irregularities formed thereon, and the surface having irregularities formed thereon, has an arithmetic mean roughness (Ra) of from 1.3 to 2.5 μm and a peak count (RPc) of from 80 to 200; and a process for producing a semiconductor package by using the mold release film."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Mold release film and process for producing semiconductor package","description":"A mold release film to be disposed on a cavity surface of a mold in a method for producing a semiconductor package wherein a semiconductor element is disposed in the mold and encapsulated with a curab","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9613832","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9613832","citation_suggestion":"Patentable. \"Mold release film and process for producing semiconductor package\" (US-9613832). https://patentable.app/patents/US-9613832","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9613832","json":"https://patentable.app/api/llm-context/US-9613832","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:03:57.609Z"}