{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9613889","patent":{"patent_number":"US-9613889","title":"Packaged circuit with a lead frame and laminate substrate","assignee":null,"inventors":[],"filing_date":"2015-03-19T00:00:00.000Z","publication_date":"2017-04-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"Embodiments of the subject application provide for a circuit comprising: a lead frame having a first plurality of exposed terminals, the lead frame defining a plane; a laminate substrate in the plane defined by the lead frame, adjacent to the lead frame, and electrically coupled to the lead frame, the laminate substrate having a first surface including a second plurality of exposed terminals and a second surface opposite the first surface; a first one or more dies mounted on the lead frame and electrically coupled to the lead frame; and a second one or more dies mounted on the second surface of the laminate substrate and electrically coupled to the laminate substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Packaged circuit with a lead frame and laminate substrate","description":"Embodiments of the subject application provide for a circuit comprising: a lead frame having a first plurality of exposed terminals, the lead frame defining a plane; a laminate substrate in the plane ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9613889","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9613889","citation_suggestion":"Patentable. \"Packaged circuit with a lead frame and laminate substrate\" (US-9613889). https://patentable.app/patents/US-9613889","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9613889","json":"https://patentable.app/api/llm-context/US-9613889","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:18:06.017Z"}