{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9613918","patent":{"patent_number":"US-9613918","title":"RF power multi-chip module package","assignee":null,"inventors":[],"filing_date":"2014-01-13T00:00:00.000Z","publication_date":"2017-04-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"High power multi-chip module packages for packaging semiconductor dice are disclosed. The disclosed packages have an output power of at least 1 kilowatt (kW) and can have an operating signal frequency in a range of hundreds of MHz. The high power multi-chip module packages have base plates with multiple planes or layers that can be conductive and may be thin metal layers in some examples. The multiple planes are formed and overlaid in such a way that they help reduce stray inductance values caused by the packaging itself, which improves overall device operation and efficiency. Current loops created when one of the multi-chip modules is in a turn-on condition are balanced and opposed and generate a minimized B-Field that is restricted by the manner in which the multiples planes of the base plate are overlaid, thus reducing the stray inductance values and improving device operation."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"RF power multi-chip module package","description":"High power multi-chip module packages for packaging semiconductor dice are disclosed. The disclosed packages have an output power of at least 1 kilowatt (kW) and can have an operating signal frequency","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9613918","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9613918","citation_suggestion":"Patentable. \"RF power multi-chip module package\" (US-9613918). https://patentable.app/patents/US-9613918","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9613918","json":"https://patentable.app/api/llm-context/US-9613918","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:31:51.383Z"}