{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9613931","patent":{"patent_number":"US-9613931","title":"Fan-out stacked system in package (SIP) having dummy dies and methods of making the same","assignee":null,"inventors":[],"filing_date":"2015-04-30T00:00:00.000Z","publication_date":"2017-04-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"An embodiment package includes a first fan-out tier, fan-out redistribution layers (RDLs) over the first fan-out tier, and a second fan-out tier over the fan-out RDLs. The first fan-out tier includes one or more first device dies and a first molding compound extending along sidewalls of the one or more first device dies. The second fan-out tier includes one or more second device dies bonded to fan-out RDLs, a dummy die bonded to the fan-out RDLs, and a second molding compound extending along sidewalls of the one or more second device dies and the dummy die. The fan-out RDLs electrically connects the one or more first device dies to the one or more second device dies, and the dummy die is substantially free of any active devices."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fan-out stacked system in package (SIP) having dummy dies and methods of making the same","description":"An embodiment package includes a first fan-out tier, fan-out redistribution layers (RDLs) over the first fan-out tier, and a second fan-out tier over the fan-out RDLs. The first fan-out tier includes ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9613931","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9613931","citation_suggestion":"Patentable. \"Fan-out stacked system in package (SIP) having dummy dies and methods of making the same\" (US-9613931). https://patentable.app/patents/US-9613931","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9613931","json":"https://patentable.app/api/llm-context/US-9613931","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T16:31:55.429Z"}