{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9613938","patent":{"patent_number":"US-9613938","title":"Module and method for manufacturing the module","assignee":null,"inventors":[],"filing_date":"2016-01-05T00:00:00.000Z","publication_date":"2017-04-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"A module includes a first substrate including first electrodes; a first element bonded to the first substrate, and including second electrodes disposed at a first end of the first element and third electrodes disposed at a second end of the first element opposite from the first end; a second substrate stacked on the first substrate and including a recess; and a second element bonded to a bottom surface of the recess of the second substrate and including fourth electrodes. The first electrodes of the first substrate are electrically connected to the second electrodes at the first end of the first element, and the third electrodes at the second end of the first element are electrically connected to the fourth electrodes of the second element via a through hole formed in the bottom surface of the recess."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Module and method for manufacturing the module","description":"A module includes a first substrate including first electrodes; a first element bonded to the first substrate, and including second electrodes disposed at a first end of the first element and third el","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9613938","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9613938","citation_suggestion":"Patentable. \"Module and method for manufacturing the module\" (US-9613938). https://patentable.app/patents/US-9613938","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9613938","json":"https://patentable.app/api/llm-context/US-9613938","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:19:52.851Z"}