{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9613942","patent":{"patent_number":"US-9613942","title":"Interposer for a package-on-package structure","assignee":null,"inventors":[],"filing_date":"2015-06-08T00:00:00.000Z","publication_date":"2017-04-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":28,"abstract":"A package-on-package (PoP) structure includes a first die, a second die, and a memory device electrically coupled to the first die and the second die by an interposer between the first die and the second die. The interposer includes copper-filled vias formed within a mold."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interposer for a package-on-package structure","description":"A package-on-package (PoP) structure includes a first die, a second die, and a memory device electrically coupled to the first die and the second die by an interposer between the first die and the sec","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9613942","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9613942","citation_suggestion":"Patentable. \"Interposer for a package-on-package structure\" (US-9613942). https://patentable.app/patents/US-9613942","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9613942","json":"https://patentable.app/api/llm-context/US-9613942","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T14:41:10.068Z"}