{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9613972","patent":{"patent_number":"US-9613972","title":"Method of manufacturing semiconductor device","assignee":null,"inventors":[],"filing_date":"2016-03-25T00:00:00.000Z","publication_date":"2017-04-04T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":14,"abstract":"In an embodiment of the present disclosure, a method of manufacturing a semiconductor device may include forming a pattern group on a substrate, the substrate being divided into first and second regions, each pattern including a silicon layer, forming an insulating pattern on the substrate, the insulating pattern partially exposing the silicon layer on the first region and blocking the silicon layer on the second region, converting the exposed silicon layer on the first region to a silicide layer while the blocked silicon layer on the second region is protected from the conversion, and performing a subsequent process using, as an overlay vernier, at least a portion of the pattern group formed on the second region."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of manufacturing semiconductor device","description":"In an embodiment of the present disclosure, a method of manufacturing a semiconductor device may include forming a pattern group on a substrate, the substrate being divided into first and second regio","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9613972","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9613972","citation_suggestion":"Patentable. \"Method of manufacturing semiconductor device\" (US-9613972). https://patentable.app/patents/US-9613972","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9613972","json":"https://patentable.app/api/llm-context/US-9613972","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:39:23.579Z"}