{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9616544","patent":{"patent_number":"US-9616544","title":"Wafer inspection method and grinding and polishing apparatus","assignee":null,"inventors":[],"filing_date":"2015-08-27T00:00:00.000Z","publication_date":"2017-04-11T00:00:00.000Z","cpc_codes":["G06T","H01L","G06T","G06T","H01L"],"num_claims":4,"abstract":"Disclosed herein is a wafer inspection method of inspecting a wafer after polishing. The wafer inspection method includes the steps of polishing the wafer after grinding, imaging a polished surface of the wafer to thereby create image data including the characteristics of plural saw marks left on the polished surface of the wafer from a detected image, performing Fourier transform to the image data to thereby extract a frequency distribution corresponding to the saw marks, performing inverse Fourier transform to the frequency distribution extracted above to obtain an amplitude of each saw mark, and determining imperfect polishing of the wafer in the case that the amplitude is greater than a predetermined range."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer inspection method and grinding and polishing apparatus","description":"Disclosed herein is a wafer inspection method of inspecting a wafer after polishing. The wafer inspection method includes the steps of polishing the wafer after grinding, imaging a polished surface of","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9616544","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9616544","citation_suggestion":"Patentable. \"Wafer inspection method and grinding and polishing apparatus\" (US-9616544). https://patentable.app/patents/US-9616544","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9616544","json":"https://patentable.app/api/llm-context/US-9616544","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:16:50.539Z"}