{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9617455","patent":{"patent_number":"US-9617455","title":"Silicone resin composition for sealant and power semiconductor module that uses this composition","assignee":null,"inventors":[],"filing_date":"2016-04-05T00:00:00.000Z","publication_date":"2017-04-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A silicone resin composition is provided that exhibits an increased adhesiveness relative to insulating circuit substrates and can prevent bubble production even when moisture absorption has occurred, exhibits an excellent heat resistance, and is free of problems such as cracking. A silicone resin composition for use as a sealant for a power semiconductor module includes an insulating circuit substrate having a Cu layer formed on a surface thereof. The silicone resin composition is formed on the Cu layer of the insulating circuit substrate, and has, after curing, a penetration of 35 to 70 and an adhesive strength of 50 to 180 kPa between the silicone resin composition and the insulating circuit substrate. The penetration is measured in accordance with JIS K 2220."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Silicone resin composition for sealant and power semiconductor module that uses this composition","description":"A silicone resin composition is provided that exhibits an increased adhesiveness relative to insulating circuit substrates and can prevent bubble production even when moisture absorption has occurred,","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9617455","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9617455","citation_suggestion":"Patentable. \"Silicone resin composition for sealant and power semiconductor module that uses this composition\" (US-9617455). https://patentable.app/patents/US-9617455","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9617455","json":"https://patentable.app/api/llm-context/US-9617455","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:30:16.836Z"}