{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9620334","patent":{"patent_number":"US-9620334","title":"Control of etch rate using modeling, feedback and impedance match","assignee":null,"inventors":[],"filing_date":"2014-01-10T00:00:00.000Z","publication_date":"2017-04-11T00:00:00.000Z","cpc_codes":["G05B"],"num_claims":23,"abstract":"A method for achieving an etch rate is described. The method includes receiving a calculated variable associated with processing a work piece in a plasma chamber. The method further includes propagating the calculated variable through a model to generate a value of the calculated variable at an output of the model, identifying a calculated processing rate associated with the value, and identifying based on the calculated processing rate a pre-determined processing rate. The method also includes identifying a pre-determined variable to be achieved at the output based on the pre-determined processing rate and identifying a characteristics associated with a real and imaginary portions of the pre-determined variable. The method includes controlling variable circuit components to achieve the characteristics to further achieve the pre-determined variable."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Control of etch rate using modeling, feedback and impedance match","description":"A method for achieving an etch rate is described. The method includes receiving a calculated variable associated with processing a work piece in a plasma chamber. The method further includes propagati","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9620334","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9620334","citation_suggestion":"Patentable. \"Control of etch rate using modeling, feedback and impedance match\" (US-9620334). https://patentable.app/patents/US-9620334","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9620334","json":"https://patentable.app/api/llm-context/US-9620334","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:18:15.951Z"}