{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9620396","patent":{"patent_number":"US-9620396","title":"Laser anneal of buried metallic interconnects including through silicon vias","assignee":null,"inventors":[],"filing_date":"2016-06-30T00:00:00.000Z","publication_date":"2017-04-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"Disclosed is a process of annealing through silicon vias (TSVs) or other deeply buried metallic interconnects using a back side laser annealing process. The process provides several advantages including sufficient grain growth and strain relief of the metal such that subsequent thermal processes do not cause further grain growth; shorter anneal times thereby reducing cycle time of 3D device fabrication; and reduced pattern sensitivity of laser absorption."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Laser anneal of buried metallic interconnects including through silicon vias","description":"Disclosed is a process of annealing through silicon vias (TSVs) or other deeply buried metallic interconnects using a back side laser annealing process. The process provides several advantages includi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9620396","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9620396","citation_suggestion":"Patentable. \"Laser anneal of buried metallic interconnects including through silicon vias\" (US-9620396). https://patentable.app/patents/US-9620396","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9620396","json":"https://patentable.app/api/llm-context/US-9620396","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:56:42.586Z"}