{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9620415","patent":{"patent_number":"US-9620415","title":"Wafer processing method","assignee":null,"inventors":[],"filing_date":"2016-08-15T00:00:00.000Z","publication_date":"2017-04-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":4,"abstract":"A wafer formed from an SiC substrate having a first surface and a second surface is divided into individual device chips. A division start point formed by a cutting blade has a depth corresponding to the finished thickness of each device chip along division lines formed on the first surface. A separation start point is formed by a laser beam having a focal point set inside the SiC substrate at a predetermined depth from the second surface, and the laser beam is applied to the second surface while relatively moving the focal point and the SiC substrate to thereby form a modified layer parallel to the first surface and cracks extending from the modified layer along a c-plane. An external force is applied to the wafer, thereby separating the wafer into a first wafer having the first surface and a second wafer having the second surface."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer processing method","description":"A wafer formed from an SiC substrate having a first surface and a second surface is divided into individual device chips. A division start point formed by a cutting blade has a depth corresponding to ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9620415","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9620415","citation_suggestion":"Patentable. \"Wafer processing method\" (US-9620415). https://patentable.app/patents/US-9620415","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9620415","json":"https://patentable.app/api/llm-context/US-9620415","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:49:50.952Z"}