{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9620434","patent":{"patent_number":"US-9620434","title":"High temperature bonding processes incorporating metal particles and bonded substrates formed therefrom","assignee":null,"inventors":[],"filing_date":"2016-03-07T00:00:00.000Z","publication_date":"2017-04-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of bonding a first substrate to a second substrate includes disposing a first high melting point metal layer onto a first substrate, disposing a first low melting point metal layer onto the first high melting point metal layer, disposing a second high melting point metal layer onto a second substrate, and disposing a second low melting point metal layer onto the second high melting point metal layer. The method further includes applying precursor metal particles onto the first and/or second low melting point metal layers, positioning the first and second low melting point metal layers such that the precursor metal particles contact both the first and second low melting point metal layers, and bonding the first substrate to the second substrate by heating the precursor metal particles and each metal layer to form an intermetallic alloy bonding layer between the first and second substrates."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"High temperature bonding processes incorporating metal particles and bonded substrates formed therefrom","description":"A method of bonding a first substrate to a second substrate includes disposing a first high melting point metal layer onto a first substrate, disposing a first low melting point metal layer onto the f","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9620434","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9620434","citation_suggestion":"Patentable. \"High temperature bonding processes incorporating metal particles and bonded substrates formed therefrom\" (US-9620434). https://patentable.app/patents/US-9620434","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9620434","json":"https://patentable.app/api/llm-context/US-9620434","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:40:42.276Z"}