{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9620440","patent":{"patent_number":"US-9620440","title":"Power module packaging with dual side cooling","assignee":null,"inventors":[],"filing_date":"2016-02-25T00:00:00.000Z","publication_date":"2017-04-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A multichip package includes a first semiconductor device mounted on a first leadframe, in which a primary heat producing surface of the first semiconductor device is oriented towards and in contact with a heat dispersing region of the first leadframe. A second semiconductor device is mounted on a second leadframe, in which a primary heat producing surface of the second semiconductor device is oriented towards and in contact with a heat dispersing region of the second leadframe. A surface of the heat dispersing region of the first leadframe is exposed on a first side of the multichip package, and a surface of the heat dispersing region of the second leadframe is exposed on a second side of the multichip package that is opposite from the first side."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Power module packaging with dual side cooling","description":"A multichip package includes a first semiconductor device mounted on a first leadframe, in which a primary heat producing surface of the first semiconductor device is oriented towards and in contact w","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9620440","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9620440","citation_suggestion":"Patentable. \"Power module packaging with dual side cooling\" (US-9620440). https://patentable.app/patents/US-9620440","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9620440","json":"https://patentable.app/api/llm-context/US-9620440","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:34:19.905Z"}