{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9620452","patent":{"patent_number":"US-9620452","title":"Via structure for optimizing signal porosity","assignee":null,"inventors":[],"filing_date":"2016-11-08T00:00:00.000Z","publication_date":"2017-04-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"An apparatus including a conductive stack structure includes an Mx layer interconnect on an Mx layer and extending in a first direction on a first track, an My layer interconnect on an My layer in which the My layer is a lower layer than the Mx layer, a first via stack coupled between the Mx layer interconnect and the My layer interconnect, a second via stack coupled between the Mx layer interconnect and the My layer interconnect, a second Mx layer interconnect extending in the first direction on a track immediately adjacent to the first track, and a third Mx layer interconnect extending in the first direction on a track immediately adjacent to the first track. The Mx layer interconnect is between the second Mx layer interconnect and the third Mx layer interconnect. The second Mx layer interconnect and the third Mx layer interconnect are uncoupled to each other."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Via structure for optimizing signal porosity","description":"An apparatus including a conductive stack structure includes an Mx layer interconnect on an Mx layer and extending in a first direction on a first track, an My layer interconnect on an My layer in whi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9620452","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9620452","citation_suggestion":"Patentable. \"Via structure for optimizing signal porosity\" (US-9620452). https://patentable.app/patents/US-9620452","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9620452","json":"https://patentable.app/api/llm-context/US-9620452","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:37:59.510Z"}