{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9620463","patent":{"patent_number":"US-9620463","title":"Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)","assignee":null,"inventors":[],"filing_date":"2015-02-27T00:00:00.000Z","publication_date":"2017-04-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":29,"abstract":"Ground shielding is achieved by a conductor shield having conductive surfaces that immediately surround individual chips within a fan-out wafer level package (FOWLP) module or device. Intra-module shielding between individual chips within the FOWLP module or device is achieved by electromagnetic or radio-signal (RF) isolation provided by the surfaces of the conductor shield immediately surrounding each of the chips. The conductor shield is directly connected to one or more grounded conductor portions of a FOWLP to ensure reliable grounding."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)","description":"Ground shielding is achieved by a conductor shield having conductive surfaces that immediately surround individual chips within a fan-out wafer level package (FOWLP) module or device. Intra-module shi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9620463","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9620463","citation_suggestion":"Patentable. \"Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)\" (US-9620463). https://patentable.app/patents/US-9620463","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9620463","json":"https://patentable.app/api/llm-context/US-9620463","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:00:14.928Z"}