{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9620468","patent":{"patent_number":"US-9620468","title":"Semiconductor packaging structure and method for forming the same","assignee":null,"inventors":[],"filing_date":"2013-11-07T00:00:00.000Z","publication_date":"2017-04-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"Various embodiments provide semiconductor packaging structures and methods for forming the same. In an exemplary method, a chip having a metal interconnect structure thereon can be provided. An insulating layer can be formed on the chip to expose the metal interconnect structure. A columnar electrode can be formed on the metal interconnect structure. A portion of the metal interconnect structure surrounding a bottom of the columnar electrode can be exposed. A diffusion barrier layer can be formed on sidewalls and a top surface of the columnar electrode, and on the exposed portion of the metal interconnect structure surrounding the bottom of the columnar electrode. A solder ball can then be formed on the diffusion barrier layer. The solder ball can wrap at least the sidewalls and the top surface of the columnar electrode."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packaging structure and method for forming the same","description":"Various embodiments provide semiconductor packaging structures and methods for forming the same. In an exemplary method, a chip having a metal interconnect structure thereon can be provided. An insula","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9620468","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9620468","citation_suggestion":"Patentable. \"Semiconductor packaging structure and method for forming the same\" (US-9620468). https://patentable.app/patents/US-9620468","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9620468","json":"https://patentable.app/api/llm-context/US-9620468","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:19:28.330Z"}