{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9620484","patent":{"patent_number":"US-9620484","title":"Semiconductor package devices including interposer openings for heat transfer member","assignee":null,"inventors":[],"filing_date":"2016-02-23T00:00:00.000Z","publication_date":"2017-04-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A semiconductor package device includes a lower package, an interposer disposed on the lower package and including a ground layer and at least one opening, and an upper package on the interposer. The lower package includes a first package substrate, a first semiconductor chip on the first package substrate, and a first molding compound layer on the first package substrate. The upper package includes a second package substrate and at least one upper semiconductor chip on the second package substrate. A heat transfer member includes a first portion disposed between the interposer and the upper package, a second portion disposed in the at least one opening of the interposer, and a third portion disposed between the interposer and the lower package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package devices including interposer openings for heat transfer member","description":"A semiconductor package device includes a lower package, an interposer disposed on the lower package and including a ground layer and at least one opening, and an upper package on the interposer. The ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9620484","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9620484","citation_suggestion":"Patentable. \"Semiconductor package devices including interposer openings for heat transfer member\" (US-9620484). https://patentable.app/patents/US-9620484","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9620484","json":"https://patentable.app/api/llm-context/US-9620484","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:48:43.830Z"}