{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9620488","patent":{"patent_number":"US-9620488","title":"Three-dimensional integrated circuit structure and bonded structure","assignee":null,"inventors":[],"filing_date":"2015-08-19T00:00:00.000Z","publication_date":"2017-04-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Three-dimensional integrated circuit (3DIC) structures are disclosed. A 3DIC structure includes a first chip, a second chip and at least one through substrate via (TSV). The first chip is electrically connected to the second chip with a first bonding pad of the first chip and a second bonding pad of the second chip. The TSV extends from a first backside of the first chip to a metallization element of the first chip. At least one conductive via is electrically connected between the TSV and the first bonding pad, and at least one elongated slot or closed space is within the at least one conductive via."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Three-dimensional integrated circuit structure and bonded structure","description":"Three-dimensional integrated circuit (3DIC) structures are disclosed. A 3DIC structure includes a first chip, a second chip and at least one through substrate via (TSV). The first chip is electrically","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9620488","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9620488","citation_suggestion":"Patentable. \"Three-dimensional integrated circuit structure and bonded structure\" (US-9620488). https://patentable.app/patents/US-9620488","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9620488","json":"https://patentable.app/api/llm-context/US-9620488","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:47:50.376Z"}