{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9620492","patent":{"patent_number":"US-9620492","title":"Package-on-package type stack package and method for manufacturing the same","assignee":null,"inventors":[],"filing_date":"2015-06-03T00:00:00.000Z","publication_date":"2017-04-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A bottom package having a first semiconductor chip and first connection members; and a top package disposed over the bottom package, and having a second semiconductor chip and second connection members electrically coupled with the first connection members. The bottom package includes an interposer having electrodes arranged along edges; first bond fingers arranged by being separated from the edges of the interposer; a first semiconductor chip disposed over the interposer to expose the electrodes, and having first bonding pads; first bonding wires electrically coupling the first bonding pads and the electrodes; second bonding wires electrically coupling the electrodes and the first bond fingers; and a first encapsulation member formed to cover the first bond fingers, the upper and side surfaces of the interposer and the first semiconductor chip, and the first and second bonding wires, and having via holes which expose portions of the second bonding wires."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package-on-package type stack package and method for manufacturing the same","description":"A bottom package having a first semiconductor chip and first connection members; and a top package disposed over the bottom package, and having a second semiconductor chip and second connection member","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9620492","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9620492","citation_suggestion":"Patentable. \"Package-on-package type stack package and method for manufacturing the same\" (US-9620492). https://patentable.app/patents/US-9620492","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9620492","json":"https://patentable.app/api/llm-context/US-9620492","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:31:05.932Z"}